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VIA AMOS 5002 1.2GHz Ultra Compact Fanless Embedded System

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VIA AMOS 5002 1.2GHz Ultra Compact Fanless Embedded System

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  • Product Code: AMOS-5002-1D12A1
  • Availability: Out of Stock

 
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Quick Overview

AMOS Embedded System with Nano E X2 1.2GHz EITX-3002 Em-ITX Board, 1 x VGA, 1 x HDMI, 2 x RS-232/422/485, 2 x GigaLAN, 2 x USB 2.0, 1 x CFast, 1 x MIC-in and 1 x Speak-out
Manufacturer VIA
Processor VIA Nano Eden X2 1.2GHz
Chipset VIA VX900 Unified Digital Media IGP chipset
Memory 1 x DDR3 1066 204-pin SDRAM SODIMM socket
Max. Capacity Up to 4GB memory size
Storage Serial ATA
1 x Onboard SATA II port, maximum data transfer rate up to 300MB/s
Onboard SATA power connector output 5V and 12V support both 2.5" and 3.5" SATA hard disk drives
Compact Flash
1 x CFast socket onboard, support Type I/II of CFast storage disk
Power Input Input Voltage
Built-in onboard DC-to-DC converter
Accepts wide range of Power Input of DC7V ~ 36V
Supports AT and ATX mode
Power Input Connector
1 x 2-pole Phoenix connector
AT/ATX Selector
Onboard AT/ATX mode switch by a 1x5-pin headers
Fuse Rating
7A / 125V
I/O Ports Front I/O Ports
COM
2 x Front-access D-Sub 9-pin connectors
USB
Supports 2 x Front-access USB 2.0 host ports by a double-deck of mini-DIN USB connector
Power Input
1 x 2-pole Phoenix power input connector
Power On/Off Switch
1x ATX Power on/off button
Rear I/O Ports
VGA
1 x Rear-access D-sub 15-pin VGA connector
HDMI
1 x Rear-access single-link HDMI connector
Dual Gigabit LAN
2 x Rear-access RJ-45 connectors
USB
2 x Rear-access USB 3.0 host ports by a pair of double stacks
Audio
2 x Rear-access 3.5Φ audio jack connectors support Speaker-Out and Mic-In via cables
Dimensions 250.2 (W) x 41(H) x 123.5 mm (D) (when system equipped with aluminum bottom chassis housing)
Operating Temp Operating Temperature
-10°C up to 50°C
Storage Temperature
-20°C - 60°C
Relative Humidity
10% - 90% @ 45°C, relative humidity, non-condensing
Expansion Built-in onboard EmIO Bus expansion interface, supports expansion interface signals 1 of PCIex8, LPC, SMBus, GPIO, DVP display interface, VCC power signals of 3.3V, 5V, 12V, and ACPI 3.0
Chassis Construction
Aluminum top cover
Dual front & rear metal face plate
(Aluminum bottom chassis housing mixed cooper heat-pie and buckled blade-fins, that installed with EITX-3002 board)
Dimension
250.2 (W) x 41(H) x 123.5 mm (D) (when system equipped with aluminum bottom chassis housing)
Weight
0.4 Kg (front plate & rear plate & top cover)
Wall Mounting
Removable wall/table mountable brackets at left & right
VESA
The heatsink of EITX-3002 equip with 4 VESA mounting holes
Supports 100 mm x 100 mm
Fanless Yes