· Compact & Light Weight Design
· Intel Atom E3845 CPU
· Up to 8GB Memory Supported
· DEF STAN 00-35 Shock
· DEF STAN 59-411 EMC
· TEMPEST SDIP-27 Level B
· 9V ~ 48V Wide DC Power Input
· -20°C to 70°C Operating Temp
With additional shock and vibration testing, the NDURA-MIL-BT complies with DEF STAN 00-35 (Shock & Vibration), DEF STAN 59-411 (EMC), and TEMPEST SDIP-27 Level B approvals making it a perfect . . .
• MIL-STD 810G Compliant
• VITA 75.22 Coldplate Mounting
• 3rd Gen Intel Core i7 Series CPU
• 8GB DDR3 Soldered Memory
• Dual Independent Displays
• Wide 10V ~ 36V DC Input
• -40°C ~ 85°C Operating Temp
Inside the tiny footprint of HPERC-IBR-HC lives the power of 3rd generation Intel Core i7 CPU & optional GPGPU parallel processing engine. Dual removable SSDs provide 12Gb/s throughput & security for . . .
• MIL-STD 810G Compliant
• VITA 75.22 Coldplate Mounting
• 3rd Gen Intel Core i7 Series CPU
• 8GB Memory Pre-Installed
• Dual Independent Displays
• Wide 10V ~ 36V DC Input
• -40°C ~ 85°C Operating Temp
Inside the tiny footprint of HPERC-IBR-MC lives the power of 3rd generation Intel Core i7 CPU & optional GPGPU parallel processing engine. Dual removable secure erase RAID-0 SSDs provide 12Gb/s throughput . . .
• MIL-STD 810G Compliant
• VITA 75.21 Passive Cooling
• 3rd Gen Intel Core i7 Series CPU
• 8GB Memory Pre-Installed
• Dual Independent Displays
• Wide 10V ~ 36V DC Input
• -40°C ~ 70°C Operating Temp
Inside the tiny footprint of HPERC-IBR-HH lives the power of 3rd generation Intel Core i7 CPU & optional GPGPU parallel processing engine. Dual removable SSDs provide 12Gb/s throughput & security for . . .
• MIL-STD 810G Compliant
• VITA 75.21 Passive Cooling
• 3rd Gen Intel Core i7 Seires CPU
• 8GB Memory Pre-Installed
• Dual Independent Displays
• Wide 10V ~ 36V DC Input
• -40°C ~ 70°C Operating Temp
Inside the tiny footprint of HPERC-IBR-MH lives the power of 3rd generation Intel Core i7 CPU & optional GPGPU parallel processing engine. Dual removable secure erase RAID-0 SSDs provide 12Gb/s throughput . . .