ADLINK Express-CF/CFE | 8th Gen Intel® Coffee Lake COMe Basic Size Type 6 Module

Steatite Embedded > Products > ADLINK Express-CF/CFE | 8th Gen Intel® Coffee Lake-H COMe Basic Size Type 6 Module

Categories

Computers & Displays Time & Positioning Motherboards & Modules Networking & I/O

Key Features

• COM Express Type 6 Basic
• Intel Xeon / Core CPU
• 48GB Memory Supported
• Three DDI Channels Supported
• Supports PCIe Expansion
• SEMA Functions Supported

Downloads

Datasheet

Quick Overview

The Express-CF/CFE is the first COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.

Contact Us

Please email or call 01527 512400 for a quote

Product Code

ADLINK Express-CF/CFE

CPU Option(s)	Intel® Xeon® E-2176M CPU Intel® Core™ i7-8850H CPU Intel® Core™ i5-8400H CPU Intel® Core™ i3-8100H CPU
Chipset	Intel® CM246 Chipset (Supports ECC Memory & Intel® AMT) Intel® QM370 Chipset (Supports Intel® AMT) Intel® HM370 Chipset (No Support For Intel® AMT)
Memory	2133/2400 MHz DDR4 Memory Up to 48GB In Three SODIMM Sockets (Xeon® paired with CM246 supports both ECC and non-ECC memory) (48GB is build support)
Storage	4 x SATA 6Gb/s (SATA0,1,2,3) SD functions as storage device only
Expansion	PCIe x16, 2 PCIe x8, or 1 PCIe x8 with 2 PCIe x4 (Gen3) 6 x PCI Express x1 (Gen3); AB Connector (Lanes 0/1/2/3/4/5) 2 x PCI Express x1 (Gen3); CD Connector (Lanes 6/7) LPC bus, SMBus (system), I2C (User)
Display	DDI1/2/3 Supporting DisplayPort 1.2, HDMI 1.4, DVI VGA: VGA support in place of DDI3 channel (Build option, max. resolution 1920 x 1200@60Hz) LVDS: Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC (Max. resolution 1920 x 1200@60Hz in dual mode) eDP: 4 lane support optional, in place of LVDS (Build option, max. resolution 4096 x 2304 @60Hz, 24bpp)
I/O Interface	4 x USB 3.1 (USB 0, 1, 2, 3) 4 x USB 2.0 (USB 4, 5, 6, 7) 2 x UART Serial Ports With Console Redirection 4 GPO & 4 GPI (GPI With Interrupt) SD/GPIO muxed Design, Switched By BIOS Setting Note: USB 3.1 Gen2 Support Dependent On Carrier Design
TPM	TPM 2.0 Infineon Chipset
Super I/O	Supported on carrier if needed (standard support for W83627DHG-P)
OS Support	Standard Support Windows® 10 (64-bit) Linux (64-bit) Extended Support (BSP) Linux (64-bit)
Power	Standard Input: ATX = 12V ±5% / 5Vsb ±5% or AT = 12V ±5% Wide Input: ATX = 8.5-20 V / 5Vsb ±5% or AT = 8.5-20V Management: ACPI 5.0 Compliant, Smart Battery Support Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO Mode (Wake-on-USB S3/S4, WOL S3/S4/S5) ECO mode: Supports Deep S5 Mode For Power Saving
Humidity	5 ~ 90% RH Operating (Non-Condensing) 5 ~ 95% RH Storage (& Operating With Conformal Coating)
Shock & Vibration	IEC 60068-2-64 & IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A & Method 214A, Table 214-I, Condition D
HALT	Thermal Stress, Vibration Stress, Thermal Shock & Combined Test
Operating Temperature	0°C to 60°C
Dimensions	Basic size: 125 mm x 95 mm