• COM Express Type 6 Basic
• 9th Gen Intel Xeon / Core CPU
• Up to 96GB Memory Supported
• Supports 3 Independent Displays
• Supports PCIe Expansion
• SEMA Functions Supported
The Express-CFR is COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 9th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake Refresh-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
Please email or call 01527 512400 for a quote
Express-CFR
CPU | Mobile 9th Generation Intel® Xeon®, Core™, Pentium® and Celeron® Processors (14nm process): | Chipset | CM246 (Supports ECC memory and Intel® AMT). | Memory | Up to 96GB* 2133/2400 MHz DDR4 in three SODIMM sockets (*under validation, max. 48GB verified). | Expansion Busses | PCIe x16 or 2 PCIe x8 or 1 PCIe x8 with 2 PCIe x4 (Gen3) | Embedded BIOS | AMI EFI with CMOS backup in 32/16MB SPI BIOS with Intel® AMT 12.0 support. | Cache | 12MB for Xeon® 6C, 8MB for Xeon® 4C, 9MB for Core™ i7, 6MB for Core™ i3, | GPU Feature Support | Intel® Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI (or VGA), LVDS | Digital Display Interface | DDI1/2/3 supporting DisplayPort 1.2, HDMI 1.4, DVI. Notes: | VGA | VGA support, in place of DDI3 channel (build option, max. resolution 1920×1200@60Hz). | LVDS | Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC (max. resolution 1920×1200@60Hz in dual mode). | eDP | 4 lane support optional, in place of LVDS (build option, max. resolution 4096×2304 @60Hz, 24bpp). | Audio | Intel® HD Audio integrated in chipset. | Ethernet | Intel® I219LM/V with AMT 12.0 support (only LM version support AMT). | Multi I/O & Storage | 4 x USB 3.1 (USB 0, 1, 2, 3) & 4 x USB 2.0 (USB 4, 5, 6, 7). Note: USB 3.1 Gen2 support dependent on carrier design. | Super I/O | Supported on carrier if needed (standard support for W83627DHG-P). | TPM | Infineon chipset. | Power | ATX = 12V ±5% / 5Vsb ±5% or AT = 12V ±5% Standard input. | OS Support | Standard Support: Extended Support (BSP): | Form Factor | PICMG COM.0, Rev 3.0 Type 6. | Dimensions | 125 mm x 95 mm Basic size. | Operating Temperature | 0°C to 60°C Standard. | Humidity | 5-90% RH operating, non-condensing. | Shock & Vibration | IEC 60068-2-64 and IEC-60068-2-27. | HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test. |
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