Mobile 9th Generation Intel® Xeon®, Core™, Pentium® and Celeron® Processors (14nm process):
– Xeon® E-2276ME 45W (35W cTDP), 6C/GT2 (ECC/non-ECC).
– Xeon® E-2276ML 25W, 6C/GT2 (ECC/non-ECC).
– Xeon® E-2254ME 45W (35W cTDP), 4C/GT2 (ECC/non-ECC).
– Xeon® E-2254ML 25W, 4C/GT2 (ECC/non-ECC).
– Core™ i7-9850HE 45W (35W cTDP), 6C/GT2.
– Core™ i7-9850HL 25W, 6C/GT2.
– Core™ i3-9100HL 25W, 4C/GT2 (ECC/non-ECC).
– Pentium® G5600E 35W, 2C/GT1 (ECC/non-ECC).
– Celeron® G4930E 35W, 2C/GT1 (ECC/non-ECC).
– Celeron® G4932E 25W, 2C/GT1 (ECC/non-ECC).

CM246 (Supports ECC memory and Intel® AMT).
QM370 (Supports Intel® AMT).
HM370 (No support for Intel® AMT).
Note: Chipset is same as Coffee Lake.

Up to 96GB* 2133/2400 MHz DDR4 in three SODIMM sockets (*under validation, max. 48GB verified).
(Xeon®, Core™ i3, Pentium®, Celeron® paired with CM246 supports both ECC and non-ECC memory).
(three sockets by build option)

PCIe x16 or 2 PCIe x8 or 1 PCIe x8 with 2 PCIe x4 (Gen3)
6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5
2 PCI Express x1 (Gen3); CD connector, Lane 6/7
LPC bus, SMBus (System), I2
C (User).

AMI EFI with CMOS backup in 32/16MB SPI BIOS with Intel® AMT 12.0 support.

12MB for Xeon® 6C, 8MB for Xeon® 4C, 9MB for Core™ i7, 6MB for Core™ i3,
4MB for Pentium®, 2MB for Celeron®

Intel® Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI (or VGA), LVDS
or eDP outputs:
– Hardware encode/transcode HD content (including HEVC 10-bit).
– DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10,DirectX 9 support.
– OpenGL 4.5 support.
– OpenCL 2.1, 2.0/1.2 support.

DDI1/2/3 supporting DisplayPort 1.2, HDMI 1.4, DVI.

Notes:
DP1.2: max. resolution is 4096×2304 @ 60Hz, 24bpp.
HDMI1.4: max. resolution is 4096×2160 @ 24Hz, 24bpp.

VGA support, in place of DDI3 channel (build option, max. resolution 1920×1200@60Hz).

Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC (max. resolution 1920×1200@60Hz in dual mode).

4 lane support optional, in place of LVDS (build option, max. resolution 4096×2304 @60Hz, 24bpp).

Intel® HD Audio integrated in chipset.
Audio Codec is located on carrier Express-BASE6 (ALC886 standard supported).

Intel® I219LM/V with AMT 12.0 support (only LM version support AMT).
10/100/1000 GbE connection.

4 x USB 3.1 (USB 0, 1, 2, 3) & 4 x USB 2.0 (USB 4, 5, 6, 7).
4 x SATA 6Gb/s (SATA0,1,2,3).
2 x UART ports with console redirection.
4 x GPO & 4 x GPI (GPI with interrupt).
SD/GPIO muxed design, switched by BIOS setting SD functions as storage device only.

Note: USB 3.1 Gen2 support dependent on carrier design.

Supported on carrier if needed (standard support for W83627DHG-P).

Infineon chipset.
TPM 2.0.

ATX = 12V ±5% / 5Vsb ±5% or AT = 12V ±5% Standard input.
ATX = 8.5-20 V / 5Vsb ±5% or AT = 8.5-20V Wide input.
ACPI 5.0 compliant, Smart Battery support management.
C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4, WOL S3/S4/S5) Power states.
Supports deep S5 mode for power saving ECO mode.

Standard Support:
Windows® 10 (64-bit).
Linux (64-bit).
VxWorks (64-bit) (TBD).

Extended Support (BSP):
Linux (64-bit).
VxWorks (64-bit) (TBD).

PICMG COM.0, Rev 3.0 Type 6.

125 mm x 95 mm Basic size.

0°C to 60°C Standard.
-40°C to +85°C (build option for selected SKUs) Extreme Rugged.

5-90% RH operating, non-condensing.
5-95% RH storage (and operating with conformal coating).

IEC 60068-2-64 and IEC-60068-2-27.
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D.

Thermal Stress, Vibration Stress, Thermal Shock and Combined Test.