Key Features

• COM Express Type 7 Basic
• Intel Atom C3000 Series CPU
• Up to 48GB ECC DDR4 Memory
• IEEE 1588 PTP Support
• Supports SEMA Functions
• -40°C ~ 85°C Operating Temp*


Quick Overview

The ADLINK Express-DN7 computer-on-module with built-in SEMA functionality is ready-made for Internet of Things (IoT) applications. The Express-DN7 is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis.

Contact Us

Please email or call 01527 512400 for a quote

Part Number

ADLINK Express-DN7

CPU Option(s)

Intel Atom® C3808 2.0GHz CPU (12MB Cache / 25W TDP / 12 Core / 2133MHz / eTEMP)
Intel Atom® C3708 1.7GHz CPU (16MB Cache / 17W TDP / 8 Core / 2133MHz / eTEMP)
Intel Atom® C3508 1.6GHz CPU (8MB Cache / 12W TDP / 4 Core / 1866MHz / eTEMP)
Intel Atom® C3308 1.6/2.1GHz CPU (4MB Cache / 10W TDP / 2 Core / 1866MHz / eTEMP)
Intel Atom® C3958 2.0GHz CPU (16MB Cache / 31W TDP / 16 Core / 2400MHz)
Intel Atom® C3858 2.0GHz CPU (12MB Cache / 25W TDP / 12 Core / 2400MHz)
Intel Atom® C3758 2.2GHz CPU (16MB Cache / 25W TDP / 8 Core / 2400MHz)
Intel Atom® C3558 2.2GHz CPU (8MB Cache / 16W TDP / 4 Core / 2133MHz)
Intel Atom® C3538 2.1GHz CPU (8MB Cache / 15W TDP / 4 Core / 2133MHz)
Intel Atom® C3338 1.5/2.2GHz CPU 4MB Cache / 9W TDP / 2 Core / 1866MHz)

Note: Availability of features may vary between SoC SKUs


On board SoC


Up to 48GB Dual Channel 2400/2133/1866 MHz DDR4 ECC (or non-ECC)
Notes: Memory Frequency & Capacity Depends On SKUs (3rd SO-DIMM Supported By Build Option)


Up to 1 PCI Express x8 Gen3; CD Connector (Lanes 16-23 x8, x4, x2, x1, Four Controllers)
Up to 1 PCI Express x8 Gen3; AB & CD Connector (Lanes 0-7 x8, x4, x2, x1, Four Controllers)
*Note: Dependent on GbE Support)
LPC Bus, SMBus (System) , I2C (User)
*Note: PCI Express Ports Dependent On SoC SKU


Up to 2 x SATA 6Gb/s (SATA 0 / 1) – Note: SATA ports dependent on SoC SKU
8GB/16GB/32GB/64GB eMMC 5.0 (Build Option)
As Storage Device (As Boot-up Device TBD)

I/O Interface

Up to 2 x USB 3.0/2.0 (USB 0 / 1)
2 x USB 2.0 (USB 2 / 3)
2 UART Ports With Console Redirection
4 GPO & 4 GPI (GPI With Interrupt TBD)
Super I/O Supported On Carrier If Needed (Standard Support For W83627DHG-P)


Intel® MAC/PHY:
– Intel® i210
– Intel® 10G Ethernet Controller Integrated in SoC (Two Controllers)
10G Interface:
– Up to 4x 10GBASE-KR (Bandwidth Dependent on SoC SKU)
Standard Interface:
– 10/100/1000 GbE Connection
NC-SI Supported on AB Connector, Connected to GbE Controller


TPM 2.0
Infineon Chipset


Standard Input: ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%
Wide Input: ATX = 8.5-20 V / 5Vsb ±5% or AT = 8.5-20V
Management: ACPI 5.0 compliant, Smart Battery support (TBD)
Power States:
– C1-C6, S0, S1, S3(TBD), S4(TBD), S5 , S5 ECO mode (Wake-on-USB S3/S4, WOL S3/S4/S5)
ECO Mode: Supports deep S5 mode for power saving

Operating Temperature

0°C to 60°C Standard
Optional: -45°C to +85°C Extreme Rugged (Only For eTEMP SKUs)


5-90% RH Operating, Non-Condensing
5-95% RH Storage (and Operating With Conformal Coating)

Form Factor

PICMG COM.0, Rev 3.0 Type 7


125 mm x 95 mm

OS Support

Standard Support:
Windows Server 2012/2016 (64-bit)
Yocto Linux (64-bit)
VxWorks 7.x (64-bit TBD)
Extended Support (BSP):
Yocto Linux (64-bit)
VxWorks 7.x (64-bit TBD)

Shock & Vibration

IEC 60068-2-64 & IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A & Method 214A, Table 214-I, Condition D


Thermal Stress, Vibration Stress, Thermal Shock & Combined Test