Military Grade Conduction Cooled Computer With 7th Gen Xeon CPU & Nvidia GPU
Key Features
- Supports NVIDIA Graphics.
- MIL-STD-810G Shock/Vibration.
- MIL-STD-461F For EMC.
- IP67 All Round Protection.
- -40 to +75°C Operating Temperature.
- 3 x Display, 4x LAN, 7x COM.
Overview
Inside the ADLINK HPERC-KBL-MC you will find the powerful 7th generation Intel® Xeon® E3-1505M v6 processor, 16GB DDR4 soldered memory and support for Windows® & Linux operating systems.
Pricing Available Upon Request
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Specifications
System
Processor(s):
Intel® Xeon® E3-1505M v6 (3.0GHz | Quad Core).
Chipset:
Intel® CM238 Chipset.
Graphics (GPGPU):
NVIDIA Quadro P1000 MXM card with 4GB GDDR5 (Optional).
NVIDIA Quadro T1000 MXM card with 4GB GDDR6 (Optional).
Memory:
16GB DDR4-2400 ECC Soldered Down.
Removable SATA:
2 x 2.5” SLC/MLC SSD on SATA 6 Gb/s.
RAID 0/1:
Intel RST.
Removable SD:
1 x SDHC – SLC (Up to 32 GB).
Expansion:
MXM (PCIe x16) (Gen3).
PCI/104 Express Type 2 (PCIe) (Gen2).
PCI Express Mini Card (PCIe) (Gen2).
I/O
IO Connectors:
MIL-DTL-38999 (Uniquely-Keyed).
Display:
2 x DVI.
1 x VGA.
3 Simultaneous Display Outputs.
Audio:
1 x Amplified Stereo Output.
1 x Stereo Input.
Ethernet:
4 x Intel® I210 Ethernet Controller (10/100/1000 Mbps).
USB:
6 x USB 2.0.
Serial:
7 x RS-232/422.
GPIO:
8 x Digital I/O.
Power
Input Voltage Range:
18 – 36VDC.
Performance:
S-States S3 / S4.
Environmental
Operating Temperature (Extreme Rugged):
-40°C to +75°C (Ambient).
Note: Max operating temperature is dependent on an external thermal solution design that keeps the temperature at any point on the cold plate surface below +85°C.
Operating Temperature (With EGX-MXM-P1000):
-40°C to +74°C (Cold Plate).
Operating Temperature (With EGX-MXM-T1000):
-40°C to +71°C (Cold Plate).
Storage Temperature:
-40°C to +85°C.
Thermal:
Internal Transfer (Passive Conduction To Body).
Cold Plate Conduction.
VITA 75.22 Mount.
Immersion:
IEC60529 (IP67).
Salt Spray:
RTCA/DO-160G, Section 14, Category S
Altitude:
0 to 50000 ft.
Relative Humidity:
95% at +60°C (Non-condensing).
Shock:
MIL-STD-810G (516.6 Procedures I and V).
Vibration:
MIL-STD-810G (514.6 Procedure I) (Categories 4, 9, 11, 21).
EMI/EMC:
MIL-STD-461F.
Power:
MIL-STD-704F & MIL-STD-1275E.
Operating Temperature:
MIL-STD-810G (501.5 Procedure II).
MIL-STD-810G (502.5, Procedure 1 and 2).
Mechanical
Form Factor:
VITA-75.22 Conductive Cold Plate.
Dimension:
(L) 223.7 x (W) 177.8 x (H) 98.7 mm.
Weight:
4.68 kg.
Other Features
TPM:
Infineon SLB 9665XT2.0.
Secure Erase:
Hardware Input Triggered.
Software Triggered.
Operating System Support:
Windows® 10 (64-bit).
RHEL 7.3.
Documentation & Support
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