9th/8th gen Intel® Core™ i7/i5/i3 & Celeron® CPU (35W/65W)
Socket LGA1151

Intel® Q370
Intel® C246 PCH (Optional)

2 x DDR4 SO-DIMM Memory Slots (ECC supported by Intel® C246 PCH)
Max Memory Supported: 64GB

2 x 2.5″ HDD drive bay (max. up 9.5 mm height)
1 x mSATA (enabled in BIOS setting)

2 x Full-size PCI Express Mini Card slot (USB + PCIe signal)
2 x SIM slot
1 x Internal MXM3.1 type A connector

2 x Serial RS-232/422/485
1 x HDMI
1 x DisplayPort (2 x DisplayPort via optional MXM kit)
1 x DVI-I
4 x Power over Ethernet (IEEE802.2at / up to 60W)
2 x 10/100/1000 Mbps Ethernet (i210-IT & i219-LM)
4 x USB 3.1 (Gen2)
2 x USB 3.1 (Gen1)
1 x Phoenix type VDC power input connector
1 x AT/ATX quick switch
1 x ATX power switch
1 x Reset switch
1 x Remote switch
1 x Flexible I/O window (Default : 2 x DB9 half-cut bracket)
4 x SMA-type antenna connector

255 levels, 1 to 255 sec.

24 VDC

Without MXM module:
-40°C to 60°C (-40°F to +140°F) with W.T. DRAM & SSD, CPU TDP 35W.
-40°C to 50°C (-40°F to +122°F) with W.T. DRAM & SSD, CPU TDP 65W.

With MXM module:
-40°C to 50°C (-40°F to +122°F) with W.T. DRAM & SSD & MXM Kit, CPU TDP 35W.

IEC 60068-2-64 (w/SSD: 3Grms STD, random, 5 – 500 Hz, 1 hr/axis).

IEC 60068-2-27 (w/SSD: 50G@wall mount,half sine, 11 ms duration).

Win 10 IoT
Linux
AXView 3.0

Wall mount kit
DIN-rail kit

280 mm x 210 mm x 80.5 mm (11.02″ x 8.26″ x 3.16″)

4.8 kg (10.58 lb) / 5.6 kg (12.34 lb)

CE, FCC Class A