Key Features

• MIL-STD-810G Compliant.
• -20 to +60°C Operating Temp.
• PCIe x16 and Mini PCIe Slots.
• Triple Display Outputs.
• 2 x Lan, 4 x USB, 3 x COM.
• Wide DC Input.

Downloads


Quick Overview

ROC249A is driven by the latest 6th generation Intel Core i3/i5/i7 (Skylake) CPU supporting outstanding CPU & graphics performance with optional support for up to 9 independent display output, 16.8V ~ 31.2V DC power input & extended operating temperature (-20°C ~ 60°C)


Contact Us

Please email or call 01527 512400 for a quote

Product Code

ROC249A

CPU

6th Generation Intel® Core™ Skylake CPU.
LGA1151 CPU Socket Supported.
Up to 35W TDP.

Chipset

Intel® Q170 / H110 Chipset.

Memory

2 x 256 Pin DDR4-2133 MHz ECC SO-DIMM.
Up to 32GB Memory supported.

Storage

2 x 2.5″ SSD / HDD Drive Bays.
1 x M.2 (NGFF) B+M Key Slot.

Expansion

1 x Full Size mPCIe Slot.
1 x SIM Card Holder.
1 x M.2 (NGFF) B+M Key Slot.
1 x PCI Express x16 Slot.

I/O

1 x HDMI 1.4b.
2 x DisplayPort.
2 x Gigabit Ethernet (RJ-45).
2 x COM (RS-232).
1 x COM (RS-232/422/485).
4 x USB 3.0.
Audio (Mic In / Line Out).
1 x 4P Rugged Terminal Connector.
1 x Power Button.

OS

Windows 7 Professional (32 / 64Bit).
Windows 8 Professional (32 / 64Bit).
Ubuntu13.04.
Ubuntu13.10.
Ubuntu14.04.
Fedora 20.

Power

16.8V ~ 31.2V DC Input.
AT / ATX Mode Select by Jumper.

Cooling

Natural Passive Convection / Conduction. (No Moving Parts).

Environmental

-20°C to 60°C Operating Temperature.

MIL-STD-810G Test

Method 507.5, Procedure II (Temperature & Humidity).
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock).
Method 516.6 Shock-Procedure I Operating (Mechanical Shock).
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration).
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration).
Method 501.5, Procedure I (Storage/High Temperature).
Method 501.5, Procedure II (Operation/High Temperature).
Method 502.5, Procedure I (Storage/Low Temperature).
Method 502.5, Procedure II (Operation/Low Temperature).
Method 503.5, Procedure I (Temperature Shock).

EMC

CE & FCC Compliance.

Dimensions

(W) 440 x (D) 400 x (H) 44 mm.